The fabrication of integrated circuits with ever smaller (sub-10 nm) features poses fundamental challenges in chemistry and materials science. As smaller nanostructures are fabricated, thinner layers of materials are required, and surfaces and interfaces gain a more important role in the formation of nanopatterns. We present a new bottom-up approach in which we use the high optical resolution offered by extreme ultraviolet (EUV) lithography to print patterns on self-assembled monolayers (SAMs). Upon radiation, low-energy electrons induce chemical changes in the SAM so that the projected image is transferred to the substrate surface. We use the chemical differences between exposed and unexposed regions to promote a selective growth of hybrid structures that can act as an etch-resistant layer for further pattern transfer or can be used as functional nanostructures. The EUV doses required to promote selective growth on exposed areas are close to industrial requirements. Furthermore, this method allows for the independent tuning of different steps in the EUV lithography process (photo-induced chemistry, spatially resolved chemical contrast, and formation of nanopatterns), an advantage over current resists, in which the same material plays all roles.

European Union's Horizon 2020
ACS Appl. Mater. Interfaces
EUV Photoresists-Former Group

Lugier, O., Thakur, N., Wu, L., Vockenhuber, M., Ekinci, Y., & Castellanos Ortega, S. (2021). Bottom-Up Nanofabrication with Extreme-Ultraviolet Light: Metal–Organic Frameworks on Patterned Monolayers. ACS Appl. Mater. Interfaces, 13(36), 43777–43786. doi:10.1021/acsami.1c13667